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1

The modified nodal approach to network analysis

Chung-Wen Ho, Ruehli, A., Brennan, P.

Journal:

IEEE Transactions on Circuits and Systems

Year:

1975

Language:

english

File:

PDF, 752 KB

english, 1975

2

Equivalent Circuit Models for Three-Dimensional Multiconductor Systems

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

1974

Language:

english

File:

PDF, 593 KB

english, 1974

3

Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs

Zhao, Biyao, Liang, Shuang, Connor, Samuel, Cocchini, Matteo, Achkir, Brice, Ruehli, Albert, Archambeault, Bruce, Fan, Jun, Drewniak, James

Journal:

Electromagnetic Compatibility Magazine, IEEE

Year:

2020

File:

PDF, 1.65 MB

2020

4

Transient analysis of lossy transmission lines: an efficient approach based on the method of Characteristics

Grivet-Talocia, S., Hao-Ming Huang, Ruehli, A.E., Canavero, F., Elfadel, I.M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2004

Language:

english

File:

PDF, 381 KB

english, 2004

5

Inductance Calculations in a Complex Integrated Circuit Environment

Journal:

IBM Journal of Research and Development

Year:

1972

Language:

english

File:

PDF, 660 KB

english, 1972

6

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Modeling electromagnetic radiation at high-density PCB/connector interfaces

Tian, Xinxin, Halligan, Matthew, Li, Xiao, Kim, Kiyeong, Chen, Hung-Chuan, Connor, Samuel, Archambeault, Bruce, Cracraft, Michael, Ruehli, Albert, Drewniak, James

Year:

2014

Language:

english

File:

PDF, 1.53 MB

english, 2014

7

[IEEE IEEE International Symposium on Electromagnetic Compatibility - Washington, DC, USA (21-23 Aug. 1990)] IEEE International Symposium on Electromagnetic Compatibility - A fast method for computing radiation from printed circuit boards

Daijavad, S., Janak, J., Heeb, H., Ruehli, A., McBride, D.

Year:

1990

Language:

english

File:

PDF, 335 KB

english, 1990

8

Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

Coperich Branch, K.M., Morsey, J., Cangellaris, A.C., Ruehli, A.E.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2002

Language:

english

File:

PDF, 621 KB

english, 2002

9

A comparative study of two transient analysis algorithms for lossy transmission lines with frequency-dependent data

Elfadel, I.M., Hao-MIng Huang,, Ruehli, A.E., Dounavis, A., Nakhla, M.S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2002

Language:

english

File:

PDF, 616 KB

english, 2002

10

Solving Low-Frequency EM-CKT Problems Using the PEEC Method

Gope, Dipanjan, Ruehli, Albert, Jandhyala, Vikram

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 716 KB

english, 2007

11

Simulation of Coupled Interconnects Using Waveform Relaxation and Transverse Partitioning

Nakhla, N.M., Ruehli, A.E., Nakhla, M.S., Achar, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 575 KB

english, 2006

12

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - On finding the optimal number of decoupling capacitors by minimizing the equivalent inductance of the PCB PDN

Shringarpure, Ketan, Zhao, Biyao, Wei, Leihao, Archambeault, Bruce, Ruehli, Albert, Cracraft, Michael, Cocchini, Matteo, Wheeler, Edward, Fan, Jun, Drewniak, James

Year:

2014

Language:

english

File:

PDF, 1.39 MB

english, 2014

13

[IEEE 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity - Santa Clara, CA, USA (2015.3.15-2015.3.21)] 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity - Analytical PDN voltage ripple calculation using simplified equivalent circuit model of PCB PDN

Zhao, Biyao, Huang, Chenxi, Shringarpure, Ketan, Fan, Jun, Archambeault, Bruce, Achkir, Brice, Connor, Samuel, Cracraft, Michael, Cocchini, Matteo, Ruehli, Albert, Drewniak, James

Year:

2015

Language:

english

File:

PDF, 889 KB

english, 2015

14

[IEEE 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity - Santa Clara, CA, USA (2015.3.15-2015.3.21)] 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity - Physical interpretation of radiation and transfer characterization based on the PEEC method

Cao, Ying S., Jiang, Li Jun, Ruehli, Albert E.

Year:

2015

Language:

english

File:

PDF, 664 KB

english, 2015

15

[IEEE 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Shenzhen, China (2016.5.17-2016.5.21)] 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Transient simulation for power integrity using physics based circuit modeling

Zhao, B., Huang, C., Shringarpure, K., Bai, S., Makharashvili, T., Cao, Y. S., Achkir, B., Cracraft, M., Cocchini, M., Connor, S., Archambeault, B., Jiang, L., Ruehli, A., Fan, J., Drewniak, J.

Year:

2016

Language:

english

File:

PDF, 1.73 MB

english, 2016

16

The Derived Equivalent Circuit Model for Magnetized Anisotropic Graphene

Cao, Ying S., Li, Ping, Jiang, Li Jun, Ruehli, Albert E.

Journal:

IEEE Transactions on Antennas and Propagation

Year:

2017

Language:

english

File:

PDF, 847 KB

english, 2017

17

Circuit Oriented Electromagnetic Modeling Using the Peec Techniques || Modified Nodal Analysis Stamps

Ruehli, Albert E., Antonini, Giulio, Jiang, Lijun

Year:

2017

Language:

english

File:

PDF, 423 KB

english, 2017

18

Macromodelling — an approach for analysing large-scale circuits

A.E. Ruehli, R.B. Rabbat, H.Y. Hsieh

Journal:

Computer-Aided Design

Year:

1978

Language:

english

File:

PDF, 920 KB

english, 1978

19

Rapid convergence of waveform relaxation

B. Leimkuhler, A. Ruehli

Journal:

Applied Numerical Mathematics

Year:

1993

Language:

english

File:

PDF, 1024 KB

english, 1993

20

Enhanced skin effect for partial-element equivalent-circuit (PEEC) models

Coperich, K.M., Ruehli, A.E., Cangellaris, A.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2000

Language:

english

File:

PDF, 865 KB

english, 2000

21

Impact of partial element accuracy on PEEC model stability

Ekman, J., Antonini, G., Orlandi, A., Ruehli, A.E.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2006

Language:

english

File:

PDF, 595 KB

english, 2006

22

Fast EMI Analysis via Transverse Partitioning and Waveform Relaxation

Sridhar, A.R., Nakhla, N.M., Achar, R., Nakhla, M.S., Ruehli, A.E.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2009

Language:

english

File:

PDF, 497 KB

english, 2009

23

Overlapping Partitioning Techniques for Simulation of Strongly Coupled Distributed Interconnects

Farhan, M.A., Nakhla, N.M., Nakhla, M.S., Achar, R., Ruehli, A.E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.02 MB

english, 2012

24

(S)PEEC: Time- and frequency-domain surface formulation for modeling conductors and dielectrics in combined circuit electromagnetic simulations

Gope, D., Ruehli, A.E., Chuanyi Yang,, Jandhyala, V.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2006

Language:

english

File:

PDF, 791 KB

english, 2006

25

Efficient Capacitance Calculations for Three-Dimensional Multiconductor Systems

Ruehli, A.E., Brennan, P.A.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

1973

Language:

english

File:

PDF, 711 KB

english, 1973

26

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Comparison of via equivalent circuit model accuracy using quasi-static and full-wave approaches

Archambeault, B., Connor, S., Jianmin Zhang,, Drewniak, J., Lai, M., Orlandi, A., Antonini, G., Ruehli, A.

Year:

2004

Language:

english

File:

PDF, 295 KB

english, 2004

27

Waveform Relaxation Time Domain Solver for Subsystem Arrays

Antonini, G., Ruehli, A.E.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2010

Language:

english

File:

PDF, 928 KB

english, 2010

28

The Waveform Relaxation Method for Time-Domain Analysis of Large Scale Integrated Circuits

Lelarasmee, E., Ruehli, A.E., Sangiovanni-Vincentelli, A.L.

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

1982

Language:

english

File:

PDF, 2.12 MB

english, 1982

29

Full-wave PEEC time-domain method for the modeling of on-chip interconnects

Restle, P.J., Ruehli, A.E., Walker, S.G., Papadopoulos, G.

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2001

Language:

english

File:

PDF, 162 KB

english, 2001

30

Physics-Based Passivity-Preserving Parameterized Model Order Reduction for PEEC Circuit Analysis

Ferranti, F., Antonini, G., Dhaene, T., Knockaert, L., Ruehli, A.E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 1.16 MB

english, 2011

31

[IEEE 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP) - San Jose, CA, USA (2008.10.27-2008.10.29)] 2008 IEEE-EPEP Electrical Performance of Electronic Packaging - Impedance design for multi-layered vias

Gu, Xiaoxiong, Ruehli, Albert E., Ritter, Mark B.

Year:

2008

Language:

english

File:

PDF, 348 KB

english, 2008

32

Electromagnetic Radiation Resulting From PCB/High-Density Connector Interfaces

Archambeault, Bruce, Connor, Sam, Halligan, Matthew S., Drewniak, James L., Ruehli, Albert E.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2013

Language:

english

File:

PDF, 786 KB

english, 2013

33

Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance

Wang, Hanfeng, Pan, Siming, Kim, Jingook, Ruehli, Albert E., Fan, Jun

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

34

[IEEE International Symposium on Electromagnetic Compatibility - Atlanta, GA, USA (14-18 Aug. 1995)] Proceedings of International Symposium on Electromagnetic Compatibility - Inductance calculations using partial inductances and macromodels

Ruehli, A., Paul, C., Garrett, J.

Year:

1995

Language:

english

File:

PDF, 493 KB

english, 1995

35

The Use of Corn Sugar in the Manufacture of Sweetened Condensed Skimmilk

Ramsey, R.J., Tracy, P.H., Ruehe, H.A.

Journal:

Journal of Dairy Science

Year:

1933

Language:

english

File:

PDF, 986 KB

english, 1933

36

Some Factors Influencing the Volume of Foam on Milk

Sanmann, F.P., Ruehe, H.A.

Journal:

Journal of Dairy Science

Year:

1930

Language:

english

File:

PDF, 817 KB

english, 1930

37

[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Including dispersive dielectrics in PEEC models

Antonini, G., Ruehli, A.E., Haridass, A.

Year:

2003

Language:

english

File:

PDF, 205 KB

english, 2003

38

[IEEE 2001 International Symposium on Electromagnetic Compatibility (EMC 2001) - Montreal, Que., Canada (13-17 Aug. 2001)] 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161) - Harten's scheme for PEEC method

Antonini, G., Orlandi, A., Ruehli, A.E.

Year:

2001

Language:

english

File:

PDF, 463 KB

english, 2001

39

[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Block partitioned Gauss-Seidel PEEC solver accelerated by QR-based coupling matrix compression techniques

Ruehli, A., Gope, D., Jandhyala, V.

Year:

2004

Language:

english

File:

PDF, 283 KB

english, 2004

40

[IEEE 2000 International Symposium on Electromagnetic Compatibility (EMC 2000) - Washington, DC, USA (21-25 Aug. 2000)] IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016) - Speed-up of PEEC method by using wavelet transform

Antonini, G., Orlandi, A., Ruehli, A.E.

Year:

2000

Language:

english

File:

PDF, 429 KB

english, 2000

41

[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Surface-based PEEC formulation for modeling conductors and dielectrics in time and frequency domain combined circuit electromagnetic simulations

Gope, D., Ruehli, A., Jandhyala, V.

Year:

2004

Language:

english

File:

PDF, 261 KB

english, 2004

42

[IEEE 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. - Chicago, Il, USA (8-12 Aug. 2005)] 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. - Reduced unknowns meshing for the partial element equivalent circuit approach

Antonini, G., Di Prinzio, M., Petricola, A., Ruehli, A.E.

Year:

2005

Language:

english

File:

PDF, 327 KB

english, 2005

43

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Stability of PEEC models with respect to partial element accuracy

Ekman, J., Antonini, G., Orlandi, A., Ruehli, A.E.

Year:

2004

Language:

english

File:

PDF, 440 KB

english, 2004

44

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - Nonorthogonal PEEC formulation for time and frequency domain modeling

Antonini, G., Ruehli, A.E., Esch, J.

Year:

2002

Language:

english

File:

PDF, 318 KB

english, 2002

45

[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Simulation of coupled interconnects using waveform relaxation and transverse partitioning

Nakhla, N., Ruehli, A., Nakhla, M., Achar, R.

Year:

2004

Language:

english

File:

PDF, 204 KB

english, 2004

46

[IEEE 1999 International Symposium on Electromagnetic Compatibility (EMC'99) - Seattle, WA, USA (2-6 Aug. 1999)] 1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261) - Review of 1998 TC-9 challenging problems results and 1999 TC-9 challenging problems introduction [EMC]

Archambeault, B., Ruehli, A.

Year:

1999

Language:

english

File:

PDF, 296 KB

english, 1999

47

[IEEE International Symposium on Electromagnetic Compatibility - Boston, MA, USA (18-22 Aug. 2003)] 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) - On modeling accuracy of EMI problems using PEEC

Ruehli, A.E., Antonini, G.

Year:

2003

Language:

english

File:

PDF, 335 KB

english, 2003

48

[IEEE IEEE 1997 IEEE 1997 International Symposium on Electromagnetic Compatibility Symposium Record - Austin, TX, USA (18-22 Aug. 1997)] IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113) - Recent improvements in PEEC modeling accuracy

Garrett, J., Ruehli, A., Paul, C.

Year:

1997

Language:

english

File:

PDF, 594 KB

english, 1997

49

[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Solving low frequency EM-CKT problems using the PEEC method

Gope, D., Ruehli, A., Jandhyala, V.

Year:

2005

Language:

english

File:

PDF, 867 KB

english, 2005

50

[IEEE 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03. - Istanbul, Turkey (2003.05.16-2003.05.16)] 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03. - A comparative study of PEEC circuit elements computation

Antonini, G., Ekman, J., Scogna, A.C., Ruehli, A.E.

Year:

2003

Language:

english

File:

PDF, 716 KB

english, 2003

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